Intel Power Supply TFX12V User Manual

TFX12V  
Thin Form Factor with 12-Volt Connector  
Power Supply Design Guide  
Version 2.0  
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
Revision History  
Version Release Date  
Notes  
1.0  
April, 2002  
May, 2002  
April, 2003  
Public release  
1.01  
1.2  
Added dimension in Figure 5 to clarify location of mounting slot feature  
Updated power and current guidance  
Added efficiency targets for light and nominal loading  
Increased minimum Efficiency at full load from 68% to 70%  
Updated guidance for standby efficiency  
Added Serial ATA connector  
Updated Revision history table  
Reformat title page  
Added cross loading tables  
Added loading tables for efficiency measurement points  
Minor modifications to Energy Star  
Updated power and current guidance  
Updated cross regulation graphs  
2.0  
February, 2004  
Updated load tables  
Updated required efficiency targets. Added recommended efficiency  
targets. Increased required minimum efficiency at typical and light load.  
Required Serial ATA connector  
Added Terminology section  
Main Power Connector changes to 2x12.  
Separate current limit on 2x2 connector for 12V2 rail  
12V2 requirements added  
3
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
Contents  
4
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
Figures  
Tables  
6
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
1 Introduction  
1.1 TFX12V Scope  
This document provides design suggestions for a small form factor power supply that is primarily intended for  
use with small form factor system designs (9-15 liters in total system volume). It should not be inferred that all  
Thin Form Factor with 12 Volt connector (TFX12V) power supplies must conform exactly to the content of this  
document, though there are key parameters that define mechanical fit across a common set of platforms.  
Since power supply needs vary depending on system configuration, the design specifics described are not  
intended to support all possible systems.  
Figure 1. TFX12V Power Supply  
1.2 TFX12V Overview  
This section provides a brief overview of the unique features of the Thin Form Factor with 12 Volt connector  
(TFX12V) power supply design and a summary of the changes included in revision 1.2.  
1.2.1 Small System Optimized Profile  
The increase in demand for smaller systems results in unique system layout challenges. The Thin Form  
Factor with 12 Volt connector (TFX12V) configuration has been optimized for small and low profile microATX  
and FlexATX system layouts. The long narrow profile of the power supply (shown in Figure 1) fits easily into  
low profile systems. The fan placement can be used to efficiently exhaust air from the processor and core  
area of the motherboard, making possible smaller, more efficient systems using common industry ingredients.  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
1.2.2 Improved Acoustics  
As desktop systems become smaller, they are placed in more exposed areas in the home and work place.  
The smaller systems are no longer confined to the floor or under the desk, but are placed on the desktop next  
to the user. In these situations, noise becomes an important factor to the end user. Thin Form Factor with 12  
Volt connector (TFX12V) supplies should use fan speed control techniques to provide a low acoustic profile,  
while providing ample cooling to internal components when required.  
1.3 Key Changes for TFX12V Version 2.0  
This section briefly summarizes the major changes made to this document that now defines ATX12V power  
supply. With the move to 12V voltage regulators for the processor, ATX guidelines for 5V as main power are  
no longer provided.  
1.3.1 Increased +12 VDC Output Capability  
System components that use 12V are continuing to increase in power. In cases where expected current  
requirements is greater than 18A a second 12 V rail should be made available. ATX12V power supplies  
should be designed to accommodate these increased +12 VDC currents.  
1.3.2 Minimum Efficiency  
Minimum measured efficiency is required to be 70% at full, typical (50%) load and 60% at light (20%) load.  
New recommended guidance has been added to provide direction for expected future requirements.  
1.3.3 Main Power Connector  
The 2 x 12 main power connector replaces the 2 x 10 connector. This change was made to support 75 watt  
PCI Express* requirements.  
1.3.4 Separate Current Limit for 12V2 on the 2x2 Connector  
The 12V rail on the 2 x 2 power connector should be a separate current limited output to meet the  
requirements of UL and EN 60950.  
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TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
1.4 Terminology  
The following terms are used in this document:  
Term  
Description  
Required  
The status given to items within this design guide, which are required to  
meet design guide and a large majority of system applications.  
Recommended  
Optional  
BA  
The status given to items within this design guide, which are not required  
to meet design guide, however, are required by many system  
applications.  
The status given to items within this design guide, which are not required  
to meet design guide, however, some system applications may optionally  
use these features.  
Declared sound power, LwAd. The declared sound power level  
shall be measured according to ISO* 7779 for the power supply  
and reported according to ISO 9296.  
CFM  
Cubic Feet per Minute (airflow).  
Monotonically  
A waveform changes from one level to another in a steady fashion,  
without intermediate retracement or oscillation.  
Noise  
The periodic or random signals over frequency band of 0 Hz to 20 MHz.  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
2 Electrical  
The following electrical requirements must be met over the environmental ranges as defined in Section 5  
(unless otherwise noted).  
2.1 AC Input  
Table 1, lists AC input voltage and frequency requirements for continuous operation. The power supply shall  
be capable of supplying full-rated output power over two input voltage ranges rated 100-127 VAC and 200-  
240 VAC rms nominal. The correct input range for use in a given environment may be either switch-  
selectable or auto-ranging. The power supply shall automatically recover from AC power loss. The power  
supply must be able to start up under peak loading at 90 VAC.  
Table 1.  
AC Input Line Requirements  
Minimum  
Parameter  
Nominal*  
115  
Maximum  
135  
Unit  
Vin (115 VAC)  
Vin (230 VAC)  
Vin Frequency  
90  
VAC rms  
VACrms  
Hz  
180  
47  
230  
265  
--  
63  
*Note: Nominal voltages for test purposes are considered to be within 1.0 V of nominal.  
2.1.1 Input Over Current Protection  
The power supply shall incorporate primary fusing for input over current protection to prevent damage to the  
power supply and meet product safety requirements. Fuses should be slow-blow–type or equivalent to  
prevent nuisance trips.1  
2.1.2 Inrush Current Limiting  
Maximum inrush current from power-on (with power-on at any point on the AC sine) and including, but not  
limited to, three line cycles, shall be limited to a level below the surge rating of the input line cord, AC switch if  
present, bridge rectifier, fuse, and EMI filter components. Repetitive ON/OFF cycling of the AC input voltage  
should not damage the power supply or cause the input fuse to blow.  
2.1.3 Input Under Voltage  
The power supply shall contain protection circuitry such that the application of an input voltage below the  
1
For Denmark and Switzerland international safety requirements, if the internal over current protective devices exceed 8A  
for Denmark and 10A for Switzerland, then the power supply must pass international safety testing to EN 60950 using a  
maximum 16A over-current protected branch circuit, and this 16A (time delay fuse) branch circuit protector must not open  
during power supply abnormal operation (output short circuit and component fault) testing.  
10  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
2.1.4 Regulatory  
The power supply is required to be tested and comply with the most current version of the following  
regulatory specification requirements and/or standards  
2.1.4.1 PRODUCT SAFETY  
UL* 60950, 3rd Edition –CAN/CSA-C22.2-60950-00,  
EN*60 950, 3rd Edition  
IEC*60 950, 3rd Edition (CB Report to include all national deviations)  
EU* Low Voltage Directive (73/23/EEC) (CE Compliance)  
GB4943-90 CCIB* (China)  
2.1.4.2 ELECTROMAGNETIC CAMPATIBILITY  
FCC*, Class B, Part 15 (Radiated & Conducted Emissions)  
CISPR* 22 / EN55022, 3rd Edition (Radiated & Conducted Emissions)  
EN55024 (ITE Specific Immunity)  
EN 61000-4-2 Electrostatic Discharge  
EN 61000-4-3Radiated RFI Immunity  
EN 61000-4-4Electrical Fast Transients.  
EN 61000-4-5 Electrical Surge  
EN 61000-4-6 RF Conducted  
EN 61000-4-8 Power Frequency Magnetic Fields  
EN 61000-4-11 Voltage Dips, Short Interrupts and Fluctuations  
EN61000-3-2 (Harmonics)  
EN61000-3-3 (Voltage Flicker)  
EU EMC Directive ((8/9/336/EEC) (CE Compliance)  
2.1.4.3 Other Certifications and/or Declarations  
GB925 (China/CCC*)  
CNS13438 (Taiwan/BSMI*)  
AS/NZ3548 (Australia/C-tick* based on CISPR22)  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
2.1.5 Catastrophic Failure Protection  
Should a component failure occur, the power supply should not exhibit any of the following:  
Flame  
Excessive smoke  
Charred PCB  
Fused PCB conductor  
Startling noise  
Emission of molten material  
Earth ground fault (short circuit to ground or chassis enclosure)  
2.2 DC Output  
2.2.1 DC Voltage Regulation  
The DC output voltages shall remain within the regulation ranges shown in Table 2, when measured at the  
load end of the output connectors under all line, load, and environmental conditions. The voltage regulation  
limits shall be maintained under continuous operation for any steady state temperature and operating  
Table 2.  
DC Output Voltage Regulation  
Output  
Range  
5%  
Minimum  
Nominal  
+12.00  
+12.00  
+5.00  
Maximum  
+12.60  
+12.60  
+5.25  
Unit  
+12 V1DC  
+12 V2DC (Note)  
+5 VDC  
+11.40  
+11.40  
+4.75  
+3.14  
-10.80  
+4.75  
Volts  
Volts  
Volts  
Volts  
Volts  
Volts  
5%  
5%  
+3.3 VDC  
-12 VDC  
5%  
+3.30  
+3.47  
10%  
5%  
-12.00  
+5.00  
-13.20  
+5.25  
+5 VSB  
Note: At +12 VDC peak loading, regulation at the +12 VDC output can go to 10%.  
2.2.2 Remote Sensing  
The +3.3 VDC output should have provisions for remote sensing to compensate for excessive cable drops.  
The default sense should be connected to pin 11 of the main power connector. The power supply should  
draw no more than 10 mA through the remote sense line to keep DC offset voltages to a minimum.  
12  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
2.2.3 Typical Power Distribution  
DC output power requirements and distributions will vary based on specific system options and  
implementation.  
Significant dependencies include the quantity and types of processors, memory, add-in card slots, and  
peripheral bays, as well as support for advanced graphics or other features. Table 3, through Table 6 show  
the power distribution and cross loading tables for power supplies in the range of 180 W to 240 W. It is  
ultimately the responsibility of the designer to define a power budget for a given target product and market.  
Table 3. Typical Power Distribution for 180 W TFX12V Configurations  
Minimum Current  
(amps)  
Rated Current  
(amps)  
Peak Current  
(amps)  
Output  
+12 VDC  
+5 VDC  
1.0  
0.3  
13.0  
15.0  
12.0 (Note)  
16.7 (Note)  
0.3  
+3.3 VDC 0.5  
-12 VDC  
+5 VSB  
0.0  
0.0  
2.0  
2.5  
Note: Total combined output of 3.3 V and 5 V is 63 W  
Peak currents may last up to 17 seconds with not more than one occurrence per minute  
180W Cross Regulation  
(5V rail + 3.3V rail vs. 12V)  
70  
60  
50  
40  
30  
20  
10  
0
Combined Power  
(5V rail + 3.3V rail)  
0
50  
100  
150  
200  
12V power (watts)  
Figure 2. Cross Loading Graph for 180W Configuration  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
Table 4. Typical Power Distribution for 220 W TFX12V Configurations  
Minimum Current  
(amps)  
Rated Current  
(amps)  
Peak Current  
(amps)  
Output  
+12 VDC  
+5 VDC  
+3.3 VDC  
-12 VDC  
+5 VSB  
1.0  
0.3  
0.5  
0.0  
0.0  
15.0  
17.0  
13.0 (Note)  
17.0 (Note)  
0.3  
2.0  
2.5  
Note: Total combined output of 3.3 V and 5 V is 80 W  
Peak currents may last up to 17 seconds with not more than one occurrence per minute  
220W Cross Regulation  
(5V rail + 3.3V rail vs. 12V)  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Combined Power  
(5V rail + 3.3V rail)  
0
50  
100  
150  
200  
12V power (watts)  
Figure 3. Cross Loading Graph for 220W Configuration  
14  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
Table 5. Typical Power Distribution for 240 W TFX12V Configurations  
Minimum Current  
(amps)  
Rated Current  
(amps)  
Peak Current  
(amps)  
Output  
+12 VDC  
+5 VDC  
+3.3 VDC  
-12 VDC  
+5 VSB  
1.0  
0.3  
0.5  
0.0  
0.0  
16.0  
18.0  
18.0 (Note)  
17.0 (Note)  
0.3  
2.0  
2.5  
Note: Total combined output of 3.3 V and 5 V is 115 W  
Peak currents may last up to 17 seconds with not more than one occurrence per minute  
240W Cross Regulation  
(5V rail + 3.3Vrail vs. 12V)  
120  
100  
80  
Combined Power  
(5V rail + 3.3V rail)  
60  
40  
20  
0
0
50  
100  
150  
200  
12V power (watts)  
Figure 4. Cross Loading Graph for 240W Configuration  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
Table 6:  
Typical Power Distribution for 270 W SFX12V Configurations  
Output  
Minimum  
Current  
(amps)  
Maximum  
Current  
(amps)  
Peak  
Current  
(amps)  
1.0  
1.0  
0.3  
0.5  
0.0  
0.0  
7.0  
13.0  
18.0  
17.0  
0.3  
9.0  
+12 V1DC  
+12 V2DC  
+5 VDC  
+3.3 VDC  
-12 VDC  
+5 VSB  
2.0  
2.5  
Note: Total combined output of 3.3 V and 5 V is  
20 W  
Peak currents may last up to 17 seconds with not more than one occurrence per minute  
270W Cross Regulation  
(5V rail + 3.3V rail vs. 12V1 +12V2)  
120  
100  
80  
60  
40  
20  
0
Combined Power  
(5V rail + 3.3V rail)  
0
40  
80  
120  
160  
200  
240  
12V power (watts)  
Figure 5 Cross Loading Graph for 270W Configuration  
2.2.4 Power Limit / Hazardous Energy Levels  
Under normal or overload conditions, no output shall continuously provide 240 VA under any conditions of  
load including output short circuit, per the requirement of UL 1950/CSA 950 / EN 60950/IEC 950 specification.  
2.2.5 Efficiency General  
The power supply should be a minimum of 70% efficient under Fullload, 70% under typicalload, and 60%  
in a lightload idle condition. The efficiency of the power supply should be tested at nominal input voltage of  
16  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
operating conditions defined in Section 3. The loading condition for testing efficiency shown in Table 7  
represents a fully loaded system, a typical (50%) loaded system, and a light (20%) loaded system.  
Table 7:  
Loading  
Efficiency Vs Load  
Full load  
70%  
Typical load  
70%  
Light load  
60%  
Required Minimum Efficiency  
75%  
80%  
68%  
Recommended Minimum Efficiency  
Table 8.  
Loading Table for Efficiency Measurements  
180W (loading shown in Amps)  
Loading  
Full  
+12V  
11  
7
+5V  
4
+3.3V  
5.8  
4
-12V  
0.3  
+5Vsb  
1.0  
1.0  
1.0  
Typical  
Light  
3
0.1  
2
0.3  
0.5  
0.0  
220W (loading shown in Amps)  
Loading  
Full  
+12V  
13  
8
+5V  
5
+3.3V  
-12V  
0.3  
+5Vsb  
1.0  
9
5
Typical  
Light  
3
0.1  
1.0  
3
0.5  
2.0  
0.0  
1.0  
240W (loading shown in Amps)  
Loading  
Full  
+12V  
14.5  
7
+5V  
7
+3.3V  
-12V  
0.2  
+5Vsb  
1.0  
7
5
Typical  
Light  
4
0.1  
1.0  
3.4  
1.0  
3.0  
0.0  
1.0  
270W (loading shown in Amps)  
Loading  
Full  
+12V1  
+12V2  
11.5  
+5V  
9.4  
4.5  
0.4  
+3.3V  
-12V  
0.2  
+5Vsb  
4
2
1
9
4
1.0  
1.0  
1.0  
Typical  
Light  
5.5  
2.4  
0.1  
0.7  
0.0  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
2.2.5.1 Energy Star*  
The Energy Starefficiency requirements of the power supply depend on the intended system configuration.  
In the low power / sleep state (S1 or S3) the system should consume power in accordance with the values  
listed in Table 9.  
Table 9. Energy Star Input Power Consumption  
Maximum Continuous Power Rating of  
Power Supply  
RMS Watts from the AC Line in Sleep/low-Power  
Mode  
< 200 W  
< 15 W  
> 200 W < 300 W  
> 300 W < 350 W  
> 350 W < 400 W  
> 400 W  
< 20 W  
< 25 W  
< 30 W  
10% of the maximum continuous output rating  
Note: To help meet the Energy Starsystem requirements, it is recommended that the power supply have > 50%  
efficiency in standby mode.  
2.2.6 Other Low Power System Requirements  
*
To help meet the Blue Angel system requirements, RAL-UZ 78, US Presidential executive order 13221,  
future EPA requirements, and other low Power system requirements the +5 VSB standby supply efficiency  
should be as high as possible. Standby efficiency is measured with the main outputs off (PS_ON# high  
state). Standby efficiency should be greater than 50% with a load of 100mA.  
2.2.7 Output Ripple/Noise  
Ripple and noise are defined as periodic or random signals over a frequency band of 10 Hz to 20 MHz.  
Measurements shall be made with an oscilloscope with 20 MHz of bandwidth. Outputs should be bypassed at  
the connector with a 0.1µF ceramic disk capacitor and a 10µF electrolytic capacitor to simulate system  
Table 10. DC Output Noise/Ripple  
Maximum Ripple and Noise  
Output  
+12 V1DC  
+12 V2DC  
+5 VDC  
(mVpp)  
120  
200  
50  
+3.3 VDC  
-12 VDC  
+5 VSB  
50  
120  
50  
18  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
V out  
Power Supply  
AC Hot  
Load must be  
isolated from the  
ground of the  
power supply.  
Load  
0.1uf  
AC Neutral  
10uf  
V return  
AC Ground  
General Notes:  
1. Load the output with its minimum load  
current.  
2. Connect the probes as shown.  
3. Repeat the measurement with maximum  
load on the output.  
Scope  
Filter Note:  
Scope Note:  
0.1uf - Kemet, C1206C104K5RAC or equivalent  
10uf - United Chemi-con, 293D106X0025D2T or  
equivalent  
Use Tektronix TDS460 Oscilloscope or  
equivalent and a P6046 probe or equivalent.  
Figure 6. Differential Noise Test Setup  
2.2.8 Output Transient Response  
Table 11 summarizes the expected output transient step sizes for each output. The transient load slew rate is  
= 1.0 A/µs.  
Table 11. DC Output Transient Step Sizes  
Maximum Step Size  
(% of rated output amps)  
Maximum Step Size  
(amps)  
Output  
+12 V1DC  
+12 V2DC  
+5 VDC  
40%  
60%  
30%  
30%  
+3.3 VDC  
-12 VDC  
+5 VSB  
0.1 A  
0.5 A  
Note: For example, for a rated +5 VDC output of 14 A, the transient step would be 30% × 14 A = 4.2 A  
Simultaneous load steps on the +12 VDC, +5 VDC, and +3.3 VDC outputs (all steps occurring in the  
same direction)  
Load-changing repetition rate of 50 Hz to 10 kHz  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
2.2.9 Capacitive Load  
The power supply should be able to power up and operate with the regulation limits defined in Table 2,  
Section 2.2.1, with the following capacitances simultaneously present on the DC outputs.  
Table 12. Output Capacitive Loads  
Output  
Capacitive Load  
(PF)  
+12 V1DC  
+12 V2DC  
+5 VDC  
5,000  
3,000  
10,000  
6,000  
350  
+3.3 VDC  
-12 VDC  
+5 VSB  
350  
2.2.10 Closed-loop Stability  
The power supply shall be unconditionally stable under all line/load/transient load conditions including  
recommended at both the maximum and minimum loads.  
2.2.11 +5 VDC / +3.3 VDC Power Sequencing  
The +12 VDC and +5 VDC output levels must be equal to or greater than the +3.3 VDC output at all times  
during power-up and normal operation. The time between the +12 VDC or +5 VDC output reaching its  
minimum in-regulation level and +3.3 VDC reaching its minimum in-regulation level must be 20 ms.  
2.2.12 Voltage Hold-up Time  
low-end nominal range115 VAC / 57 Hz or 230 VAC / 47 Hz - at maximum continuous output load as  
applicable for a minimum of 17 ms.  
20  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
2.3 Timing / Housekeeping / Control  
T1  
T5  
~
VAC  
PS_ON#  
~
~
+12VDC  
95%  
+5VDC  
O/P's  
}
+3.3VDC  
10%  
T2  
T3  
~
PWR_OK  
T6  
T4  
timing_3_5_12b  
PWR_OK Sense Level = 95% of nominal  
Figure 7. Power Supply Timing  
Notes: T1 is defined in Section 2.3.4. , T2 in Section 2.3.5. ,T3, T4, T5, and T6 are defined in Table 13.  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
2.3.1 PWR_OK  
PWR_OK is a power goodsignal. This signal should be asserted high by the power supply to indicate that  
the +12 VDC, +5 VDC, and +3.3 VDC outputs are above the under voltage thresholds listed in Table 2 in  
Section 2.2.1 and that sufficient mains energy is stored by the converter to guarantee continuous power  
Conversely, PWR_OK should be de-asserted to a low state when any of the +12 VDC, +5 VDC, or +3.3 VDC  
output voltages falls below its under voltage threshold, or when mains power has been removed for a time  
sufficiently long such that power supply operation cannot be guaranteed beyond the power-down warning  
time. The electrical and timing characteristics of the PWR_OK signal are given in Table 13 and in Figure 7.  
Table 13. PWR_OK Signal Characteristics  
Signal Type  
+5 V TTL compatible  
< 0.4 V while sinking 4 mA  
Between 2.4 V and 5 V output while sourcing 200 µA  
1 kfrom output to common  
100 ms < T3 < 500 ms  
T4 10 ms  
Logic level low  
Logic level high  
High-state output impedance  
PWR_OK delay  
PWR_OK rise time  
AC loss to PWR_OK hold-up time  
Power-down warning  
T5 16 ms  
T6 1 ms  
2.3.2 PS_ON#  
PS_ON# is an active-low, TTL-compatible signal that allows a motherboard to remotely control the power  
*
supply in conjunction with features such as soft on/off, Wake on LAN , or wake-on-modem. When PS_ON# is  
pulled to TTL low, the power supply should turn on the four main DC output rails: +12 VDC, +5 VDC, +3.3  
VDC, and -12 VDC. When PS_ON# is pulled to TTL high or open-circuited, the DC output rails should not  
deliver current and should be held at zero potential with respect to ground. PS_ON# has no effect on the +5  
VSB output, which is always enabled whenever the AC power is present. Table 14 lists PS_ON# signal  
characteristics.  
The power supply shall provide an internal pull-up to TTL high. The power supply shall also provide de-  
bounce circuitry on PS_ON# to prevent it from oscillating on/off at startup when activated by a mechanical  
switch. The DC output enable circuitry must be SELV-compliant.  
The power supply shall not latch into a shutdown state when PS_ON# is driven active by pulses between  
10ms to 100ms during the decay of the power rails.  
22  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
Table 14. PS_ON# Signal Characteristics  
Parameter  
Minimum  
Maximum  
0.8 V  
VIL, Input Low Voltage  
0.0 V  
IIL, Input Low Current (Vin = 0.4 V)  
VIH, Input High Voltage (Iin = -200 µA)  
VIH open circuit, Iin = 0  
-1.6 mA  
2.0 V  
5.25 V  
Hysteresis 0.3 V  
Disable  
2.0 V  
PS is  
0.8 V  
PS is  
disabled  
enabled  
Enable  
5.25 = Maximum Open-  
Circuit Voltage  
0.8  
2.0  
PS_ON# Voltage  
Figure 8. PS_ON# Signal Characteristics  
2.3.3 +5 VSB  
+5 VSB is a standby supply output that is active whenever the AC power is present. This output provides a  
power source for circuits that must remain operational when the five main DC output rails are in a disabled  
state. Example uses include soft power control, Wake on LAN, wake-on-modem, intrusion detection, or  
suspend state activities.  
The +5 VSB output should be capable of delivering a minimum of 2.0 A. at +5 V 5% to external circuits.  
The power supply must be able to provide the required power during a "wake up" event. If an external USB  
device generates the event, there may be peak currents as high as 2.5 A., lasting no more than 500 ms.  
Over current protection is required on the +5 VSB output regardless of the output current rating. This ensures  
the power supply will not be damaged if external circuits draw more current than the supply can provide.  
2.3.4 Power-on Time  
The power-on time is defined as the time from when PS_ON# is pulled low to when the +12 VDC, +5 VDC,  
and +3.3 VDC outputs are within the regulation ranges specified in Section 2.2.1. The power-on time shall be  
less than 500 ms (T1 < 500 ms).  
+5 VSB shall have a power-on time of two seconds maximum after application of valid AC voltages.  
 
 
TFX12V Power Supply Design Guide  
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Version 2.0  
2.3.5 Rise Time  
The output voltages shall rise from 10% of nominal to within the regulation ranges specified in Section 2.2.1  
within 0.2 ms to 20 ms (0.2 ms T2 20 ms).  
There must be a smooth and continuous ramp of each DC output voltage from 10% to 90% of its final set  
point within the regulation band, while loaded as specified in Section 2.2.1.  
The smooth turn-on requires that, during the 10% to 90% portion of the rise time, the slope of the turn-on  
waveform must be positive and have a value of between 0 V/ms and [Vout, nominal / 0.1] V/ms. Also, for any  
5 ms segment of the 10% to 90% rise time waveform, a straight line drawn between the end points of the  
waveform segment must have a slope [Vout, nominal / 20] V/ms.  
2.3.6 Overshoot at Turn-on / Turn-off  
The output voltage overshoot upon the application or removal of the input voltage, or the assertion/de-  
voltage. No voltage of opposite polarity shall be present on any output during turn-on or turn-off.  
2.3.7 Reset after Shutdown  
If the power supply latches into a shutdown state because of a fault condition on its outputs, the power supply  
shall return to normal operation only after the fault has been removed and the PS_ON# has been cycled  
OFF/ON with a minimum OFF time of one second.  
2.3.8 +5 VSB at AC Power-down  
After AC power is removed, the +5 VSB standby voltage output should remain at its steady state value for the  
decrease shall be monotonic in nature, dropping to 0.0 V. There shall be no other disturbances of this voltage  
at or following removal of AC power.  
2.4 Output Protection  
2.4.1 Over Voltage Protection  
The over voltage sense circuitry and reference shall reside in packages that are separate and distinct from  
the regulator control circuitry and reference. No single point fault shall be able to cause a sustained over  
voltage condition on any or all outputs. The supply shall provide latch-mode over voltage protection as  
24  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
Table 15. Over Voltage Protection  
Output  
Minimum  
Nominal  
15.0  
15.0  
6.3  
Maximum  
Unit  
+12 V1DC  
+12 V2DC  
+5 VDC  
13.4  
13.4  
5.74  
3.76  
15.6  
15.6  
7.0  
Volts  
Volts  
Volts  
Volts  
+3.3 VDC  
4.2  
4.3  
2.4.2 Short-circuit Protection  
An output short circuit is defined as any output impedance of less than 0.1 ohms. The power supply shall  
shut down and latch off for shorting the +3.3 VDC, +5 VDC, or +12 VDC rails to return or any other rail.  
Shorts between main output rails and +5 VSB shall not cause any damage to the power supply. The power  
supply shall either shut down and latch off or fold back for shorting the negative rails. +5 VSB must be  
capable of being shorted indefinitely, but when the short is removed, the power supply shall recover  
automatically or by cycling PS_ON#. The power supply shall be capable of withstanding a continuous short  
circuit to the output without damage or overstress to the unit (for example, to components, PCB traces, and  
2.4.3 No-load Operation  
No damage or hazardous condition should occur with all the DC output connectors disconnected from the  
load. The power supply may latch into the shutdown state.  
2.4.4 Over Current Protection  
Overload currents applied to each tested output rail cause the output to trip before reaching or exceeding 240  
VA. For testing purposes, the overloaded currents should be ramped at a minimum rate of 10 A/s starting  
from full load.  
2.4.5 Over-temperature Protection  
As an option, the power supply may include an over-temperature protection sensor, which can trip and shut  
down the power supply at a preset temperature point. Such an overheated condition is typically the result of  
internal current overloading or a cooling fan failure. If the protection circuit is non-latching, then it should have  
hysteresis built in to avoid intermittent tripping.  
2.4.6 Output Bypass  
The output return may be connected to the power supply chassis, and will be connected to the system  
chassis by the system components.  
 
 
TFX12V Power Supply Design Guide  
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Version 2.0  
3 Mechanical  
3.1 Labeling /Marking  
The following is a non-inclusive list of suggested markings for each power supply unit. Product regulation  
stipulations for sale into various geographies may impose additional labeling requirements.  
Manufacturer information: manufacturers name, part number and lot date code, etc., in human-readable  
text and/or bar code formats  
Nominal AC input operating voltages (100-127 VAC and 200-240 VAC) and current rating certified by all  
applicable safety agencies  
DC output voltages and current ratings  
Access warning text (Do not remove this cover. Trained service personnel only. No user serviceable  
components inside.) must be in English, German, Spanish, French, Chinese, and Japanese with  
universal warning markings  
3.2 Physical Dimensions  
The power supply shall be enclosed and meet the physical outline shown in Figure 9, as applicable.  
26  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
Figure 9. Power Supply Dimensions and Recommended Feature Placements (not to scale)  
 
 
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Thin Form Factor with 12 V Connector  
Version 2.0  
Figure 10. Power Supply Mounting Slot Detail  
28  
 
 
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Thin Form Factor with 12-V Connector  
Version 2.0  
3.3 Mounting Options  
The TFX12V mechanical design provides two options for mounting in a system chassis. The unit can be  
mounted using one of the mounting holes on the front end (non-vented end) or a chassis feature can be  
designed to engage the slot provided in the bottom of the supply. In order to accommodate different system  
chassis layouts, the TFX12V power supply is also designed to mount in two orientations (fan left and fan right)  
as shown in Figure 11. A mounting hole and slot should be provided for each orientation as shown in  
Figure 9. Details of a suggested geometry for the mounting slot are shown in Figure 10.  
Figure 11. Fan Right and Fan Left Orientations of Power Supply in a Chassis  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
3.4 Chassis Requirements  
To ensure the power supply can be easily integrated, the following features should be designed into a chassis  
intended to use a TFX12V power supply:  
Chassis cutout (normally in the rear panel of the chassis) as shown in Figure 12.  
EITHER a mounting bracket to interface with the forward mounting hole on the power supply OR a  
mounting tab as shown in Figure 13 to interface with the mounting slot on the bottom of the power  
supply  
Figure 12. Suggested TFX12V Chassis Cutout  
Figure 13. Suggested Mounting Tab (chassis feature)  
30  
 
 
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3.5 Airflow / Fan  
The designers choice of a power supply cooling solution depends in part on the targeted end-use system  
application(s). At a minimum, the power supply design must ensure its own reliable and safe operation.  
Fan location/direction: In general, exhausting air from the system chassis enclosure via a power supply fan  
is the preferred, most common, and most widely applicable system-level airflow solution. The location of the  
fan can have a large effect on how efficiently this air is exhausted. The location of the fan shown in Figure 9  
allows the fan to be located close to the processor cooling solution when used in the common fan left  
configuration shown in Figure 11. This close proximity of the fan will aid in the evacuation of heated air and  
helps keep the total system cooler.  
Fan size/speed: The TFX12V power supply has an 80 mm axial fan as shown in Figure 9. It is  
recommended that a thermally sensitive fan speed control circuit be used to balance system-level thermal  
and acoustic performance. The circuit typically senses the temperature of the secondary heat sink and/or  
incoming ambient air and adjusts the fan speed as necessary to keep power supply and system component  
temperatures within specifications. Both the power supply and system designers should be aware of the  
dependencies of the power supply and system temperatures on the control circuit response curve and fan  
size and should specify them carefully.  
The power supply fan should be turned off when PS_ON# is de-asserted (high). In this state, any remaining  
active power supply circuitry must rely only on passive convection for cooling.  
Venting: In general, more venting in a power supply case yields reduced airflow impedance and improved  
cooling performance. Intake and exhaust vents should be as large, open, and unobstructed as possible so as  
not to impede airflow or generate excessive acoustic noise. In particular, avoid placing objects within 0.5  
inches of the intake or exhaust of the fan itself. A raised wire fan grill is recommended instead of a stamped  
metal vent for improved airflow and reduced acoustic noise for the intake vent. Figure 9 shows the suggested  
TFX12V exhaust vent pattern.  
Considerations to the previous venting guidelines are:  
Openings must be sufficiently designed to meet the safety requirements described in Section 5.  
Larger openings yield decreased EMI-shielding performance. The suggested pattern in Figure 9  
sufficiently shields EMI in most power supplies, but the design should always be tested as outlined in  
NOTE:  
Venting in inappropriate locations can detrimentally allow airflow to bypass those areas where it is needed.  
3.6 AC Connector  
The AC input receptacle should be an IEC 320 type or equivalent. In lieu of a dedicated switch, the IEC 320  
receptacle may be considered the mains disconnect.  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
3.7 DC Connectors  
Figure 14 shows pin outs and profiles for typical TFX12V power supply DC harness connectors. The TFX12V  
requires an additional two-pin, power connector.  
UL Listed or recognized component appliance wiring material rated min 85 °C, 300 VDC shall be used for all  
output wiring.  
There are no specific requirements for output wire harness lengths, as these are largely a function of the  
intended end-use chassis, motherboard, and peripherals. Ideally, wires should be short to minimize  
electrical/airflow impedance and simplify manufacturing, yet they should be long enough to make all  
necessary connections without any wire tension (which can cause disconnections during shipping and  
handling). Recommended minimum harness lengths for general-use power supplies is 150 mm for all wire  
harnesses. Measurements are made from the exit port of the power supply case to the wire side of the first  
connector on the harness.  
1
13  
+3.3 V
+3.3 V
COM  
+3.3 V
-12V
COM  
PS_ON  
+5V
COM  
#
COM  
+5V
COM  
COM  
COM  
PWR_OK  
NC  
+5VSB  
+5V
+5V
+5V
COM  
+12V1
+12V2
+3.3V
Main Power Connector  
Figure 14. TFX12V Connectors (Pin-side view, not to scale)  
32  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
3.7.1 TFX12V Main Power Connector  
*
Connector: MOLEX 39-01-2240 or equivalent  
(Mating motherboard connector is Molex 44206-0007 or equivalent)  
18 AWG is suggested for all wires except for the +3.3 V supply and sense return wires combined into pin 11  
(22 AWG).  
Pin  
Signal  
Color  
Pin  
13  
Signal  
Color  
1
+3.3 VDC  
Orange  
+3.3 VDC  
Orange  
[13]  
[+3.3 V default [Brown]  
sense]  
2
+3.3 VDC  
COM  
Orange  
Black  
Red  
14  
15  
16  
17  
18  
19  
20  
21  
22  
-12 VDC  
COM  
Blue  
Black  
Green  
Black  
Black  
Black  
NC  
3
4
+5 VDC  
COM  
PS_ON#  
COM  
5
Black  
Red  
6
+5 VDC  
COM  
COM  
7
Black  
Gray  
COM  
8
PWR_OK  
+5 VSB  
+12 V1DC  
Reserved  
+5 VDC  
+5 VDC  
9
Purple  
Yellow  
Red  
10  
Red  
11  
12  
+12 V1DC  
+3.3 VDC  
Yellow  
23  
24  
+5 VDC  
COM  
Red  
Orange  
Black  
3.7.2 Peripheral Connector(s)  
*
*
Connector: AMP 1-480424-0 or MOLEX 8981-04P or equivalent.  
Contacts: AMP 61314-1 or equivalent.  
Pin  
1
Signal  
+12 V1DC  
COM  
18 AWG Wire  
Yellow  
Black  
2
3
COM  
Black  
4
+5 VDC  
Red  
3.7.3 Floppy Drive Connector  
*
Connector: AMP 171822-4 or equivalent  
Pin  
1
Signal  
+5 VDC  
COM  
20 AWG Wire  
Red  
2
Black  
3
COM  
Black  
4
+12 V1DC  
Yellow  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
3.7.4 +12 V Power Connector  
*
*
Connector: MOLEX 39-01-2040 or equivalent (Mating motherboard connector is Molex  
39-29-9042 or equivalent)  
Pin  
1
Signal  
COM  
COM  
18 AWG Wire  
Black  
Pin  
3
Signal  
18 AWG Wire  
+12 V2DC  
+12 V2DC  
Yellow /Black Stripe  
Yellow /Black Stripe  
2
Black  
4
3.7.5 Serial ATA Power Connector  
This is an optional connector for systems with Serial ATA devices.  
The detailed requirements for the Serial ATA Power Connector can be found in the Serial ATA: High Speed  
Serialized AT Attachmentspecification, Section 6.3 Cables and connector specification”  
*
Connector: MOLEX 88751 or equivalent.  
Wire Signal  
18 AWG Wire  
Orange  
Black  
5
4
3
2
+3.3 VDC  
COM  
+5 VDC  
COM  
Red  
Black  
1
+12 V1DC  
Yellow  
Wire#  
5
4
3
2
1
Figure 15. Serial ATA Connector  
34  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12-V Connector  
Version 2.0  
4 Environmental  
The following subsections define recommended environmental specifications and test parameters, based on  
the typical conditions a TFX12V power supply unit may be subjected to during operation or shipment.  
4.1 Temperature  
Operating ambient: +10 °C to +50 °C (At full load, with a maximum temperature rate of change of 5 °C/10  
minutes, but no more than 10 °C/hr.)  
Non-operating ambient: -40 °C to +70 °C (Maximum temperature rate of change of 20 °C/hr.)  
4.2 Thermal Shock (Shipping)  
Non-operating: -40 °C to +70 °C  
15 °C/min Dt/dt 30 °C/min. Tested for 50 cycles; Duration of exposure to temperature extremes for  
each half cycle shall be 30 minutes.  
4.3 Relative Humidity  
Operating: To 85% relative humidity (non-condensing)  
Non-operating: To 95% relative humidity (non-condensing)  
Note: 95% RH is achieved with a dry bulb temperature of 55 °C and a wet bulb temperature of 54 °C.  
4.4 Altitude Requirement  
Operating: To 10,000 ft  
Non-operating: To 50,000 ft  
4.5 Mechanical Shock  
Non-operating: 50 g, trapezoidal input; velocity change 170 in/s  
Three drops on each of six faces are applied to each sample.  
35  
 
 
TFX12V Power Supply Design Guide  
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Version 2.0  
4.6 Random Vibration  
Non-operating: 0.01 g²/Hz at 5 Hz, sloping to 0.02 g²/Hz at 20 Hz, and maintaining 0.02 g²/Hz from 20 Hz to  
500 Hz. The area under the PSD curve is 3.13 gRMS. The duration shall be 10 minutes per axis for all three  
axes on all samples.  
4.7 Acoustics  
Sound Power: The power supply assembly shall not produce a declared sound power level greater than 3.8  
BA. Sound power determination is to be performed at 43C, 50% of rated load, at sea level. This test point is  
chosen to represent the environment seen inside a typical system at the idle acoustic test condition, with the  
43C being derived from the standard ambient assumption of 23C, with 20C added for the temperature  
rise within the system (what is typically seen by the inlet fan). The declared sound power level shall be  
measured according to ISO 7779 and reported according to ISO 9296.  
Pure Tones: The power supply assembly shall not produce any prominent discrete tone determined  
according to ISO 7779, Annex D.  
4.8 Ecological Requirements  
The following materials must not be used during design and/or manufacturing of this product:  
Cadmium shall not be used in painting or plating.  
Quaternary salt and PCB electrolytic capacitors shall not be used.  
CFCs or HFCs shall not be used in the design or manufacturing process.  
Mercury shall not be used.  
36  
 
 
TFX12V Power Supply Design Guide  
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Version 2.0  
5 Safety  
The following subsections outline sample product regulations requirements for a typical power supply. Actual  
requirements will depend on the design, product end use, target geography, and other variables. Consult  
your companys Product Safety and Regulations department for more details.  
5.1 North America  
The power supply must be certified by an NRTL (Nationally Recognized Testing Laboratory) for use in the  
USA and Canada under the following conditions:  
The supply must be recognized for use in Information Technology Equipment including Electrical  
Business Equipment per UL 60950, 3rd edition, 2000. The certification must include external enclosure  
testing for the AC receptacle side of the power supply.  
The supply must have a full complement of tests conducted as part of the certification, such as input  
current, leakage current, hi-pot, temperature, energy discharge test, transformer output characterization  
test (open-circuit voltage, short-circuit current, and maximum VA output), and abnormal testing (to include  
stalled-fan tests and voltage-selectswitch mismatch).  
The enclosure must meet fire enclosure mechanical test requirements per clauses 2.9.1 and 4.2 of the  
above-mentioned standard.  
100% production HiPot testing must be included and marked as such on the power supply enclosure.  
There must not be unusual or difficult conditions of acceptability such as mandatory additional cooling or  
power de-rating. The insulation system shall not have temperatures exceeding their rating when tested in the  
end product.  
The certification mark shall be marked on each power supply.  
The power supply must be evaluated for operator-accessible secondary outputs (reinforced insulation) that  
meet the requirements for SELV and do not exceed 240 VA under any condition of loading.  
The proper polarity between the AC input receptacle and any printed wiring boards connections must be  
maintained (that is, brown=line, blue=neutral, and green or green/yellow =earth/chassis).  
Failure of any single component in the fan-speed control circuit shall not cause the internal component  
temperatures to exceed the abnormal fault condition temperatures per the IEC 60950 3rd ed., 1999  
Specification.  
5.2 International  
The vendor must provide a complete CB certificate and test report to IEC 60950: 3rd ed., 1999 . The CB  
report must include ALL CB member country national deviations. CB report must include evaluation to EN  
60950: 2000. All evaluations and certifications must be for reinforced insulation between primary and  
secondary circuits.  
37  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
6 Electromagnetic Compatibility  
The following subsections outline applicable product regulatory requirements for the TFX12V power supply.  
Additional requirements may be applied dependent upon the design, product end use (e.g., medical  
equipment and hazardous locations), target geography, and other variables.  
6.1 Emissions  
The power supply shall comply with FCC Part 15, EN55022: 1998 and CISPR 22: 1997, meeting Class B for  
both conducted and radiated emissions with a 4 dB margin. Tests shall be conducted using a shielded DC  
output cable to a shielded load. The load shall be adjusted as follows for three tests: No load on each output;  
50% load on each output; 100% load on each output. Tests will be performed at 100 VAC 50Hz, 120 VAC 60  
Hz, and 230 VAC 50 Hz power.  
6.2 Immunity  
The power supply shall comply with EN 55024:1998 and CISPR 24 specifications prior to sale in the EU  
(European Union), Korea, and possibly other geographies.  
38  
 
 
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6.3 Input Line Current Harmonic Content  
For sales in the EU (European Union) the power supply shall meet the requirements of  
EN61000-3-2 Class D and the Guidelines for the Suppression of Harmonics in Appliances and General Use  
Equipment Class D for harmonic line current content at full rated power. See Table 16 for the harmonic limits.  
Table 16. Harmonic Limits, Class D Equipment  
Per: EN 61000-3-2  
Per: JEIDA MITI  
Maximum permissible Harmonic  
current at 230 VAC / 50 Hz in Amps  
Maximum permissible Harmonic  
current at 100VAC / 50 Hz in Amps  
Harmonic Order n  
Odd harmonics  
3
2.3  
5.29  
5
1.14  
2.622  
7
0.77  
1.771  
9
0.4  
0.92  
11  
0.33  
0.759  
13  
0.21  
0.483  
0.15 x (15/n)  
0.345 x (15/n)  
15n 39  
6.4 Magnetic Leakage Fields  
A PFC choke magnetic leakage field should not cause any interference with a high-resolution computer  
monitor placed next to or on top of the end-use chassis.  
6.5 Voltage Fluctuations and Flicker  
The power supply shall meet the specified limits of the EN61000-3-3 Specification for voltage fluctuations and  
flicker for equipment drawing not more then16 AAC, connected to low voltage distribution systems.  
39  
 
 
TFX12V Power Supply Design Guide  
Thin Form Factor with 12 V Connector  
Version 2.0  
7 System Cooling Considerations  
The power supply fan location allows the system designer to utilize the airflow to help cool critical components  
such as the processor and chipset. Please note that the fan pulls air from the system, instead of blowing hot  
air in, so components must be placed such that airflow is directed across critical components. Cables, etc  
must not impede airflow.  
For more information on system thermal design, please refer to http://www.formfactors.org/.  
8 Reliability  
The de-rating process promotes quality and high reliability. All electronic components should be designed  
with conservative device d-ratings for use in commercial and industrial environments.  
9 Applicable Documents  
The following documents support this design guide as additional reference material.  
Document Title  
Description  
FCC Rules Part 15, Class B  
ICES-003: 1997, Class B  
Title 47, Code of Federal Regulations, Part 15  
Interference-Causing Equipment Standard Digital Apparatus  
EN 55022: 1998 +  
Information Technology Equipment Radio disturbance characteristics –  
Amendment A1:2000 Class B  
Limits and methods of measurement  
Information Technology Equipment Radio disturbance characteristics –  
Limits and methods of measurement  
CISPR 22: 1997, Class B  
AS/NZS 3548:1995, Class B  
EN 55024:1998  
Information Technology Equipment Radio disturbance characteristics –  
Limits and methods of measurement  
Information Technology Equipment Immunity Characteristics Limits and  
methods of measurement  
IEC 60950, 3rd ed., 1999  
EN 60950: 2000  
UL 60950, 3rd ed., 2000  
Safety of Information Technology Equipment  
Safety of Information Technology Equipment  
Safety of Information Technology Equipment  
Safety of Information Technology Equipment  
CSA 22.2 No. 60950-00  
40  
 
 

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